中文Design Capability
Item | Package Design | Electrical Simulation | Thermal Management | Mechanical Analysis |
1 | FC/WB BGA Design | Impedance matching and control | Thermal design and verification | Process simulation (Molding, Reflow, etc.) |
2 | MCM /SiP Design | Lumped parameter elements extraction | Thermo-electrical co-simulation | Thermo-mechanical simulation (TC, HTS) |
3 | WLCSP / Fan out WLP design | S parameters extraction | Hot spot effect evaluation | Humidity simulation |
4 | PoP/PiP design | TDR analysis | Thermal resistance extraction | Hygro-mechanical simulation |
5 | FPC design | SI/PI analysis | - | Thermo-mechanical-moisture simulation (HAST, 85°C/85RH, etc.) |
6 | 2.5D Interposer Design | EMI analysis | - | Drop test |
7 | Ceramic Design | IPD simulation | - | - |
8 | IPD Design | RF/MW System simulation | - | - |
Mask graphic design
Support single chip, multi - chip Mosaic
Support 2Image,4Image,6Image,and so on a variety of patchwork requirements，max shot size：44mm*26mm
Support mask stitching technology, can encapsulate very large chip
System module design
Support multi-chip packaging
Support chip and passive device integrated package
Support for 3D stack package
