The signal and power supply of high speed/high frequency substrates were analyzed

• SI：S Parameter extraction，RLCG  Parameter extraction、The time domain analysis 、Eye diagram analysis

• PI: Dc voltage drop analysis、AC Impedance analysis、Synchronous switching noise analysis

Simulation of silicon-based Interposer GSG structure

Simulation and test of system link structure

Power time domain simulation	Planar resonance simulation of power supply	Dc voltage drop simulation

Thermal simulation of structural stress

• Structural stress -- package structure selection and optimization, reliability and failure prediction, warping analysis

• Encapsulation heat simulation -- encapsulation junction temperature and heat resistance extraction, encapsulation heat dissipation scheme selection and optimization

• Simulation of plate-level and wafer level plastic sealing process -- Filling process analysis and defect prediction, process and material optimization

TSV轉(zhuǎn)接板結(jié)構(gòu)仿真	標(biāo)準(zhǔn)封裝結(jié)溫?zé)嶙杼崛?/td>	板級(jí)塑封工藝仿真
TSV轉(zhuǎn)接 板結(jié)構(gòu)仿真	封裝散熱優(yōu)化	晶圓級(jí)塑封工藝仿真

Structural process simulation analysis

• Package warp prediction and structure optimizati

• Thermal stress and reliability simulation

• Analysis and defect prediction of plastic sealing process

Warping prediction for board level packaging	CPI reliability Analysis	Simulation and optimization of bottom filling process