中文Test structure sheet
We can provide the following specifications of the standard fake, can also be customized according to customer needs.
| RDL | TSV (outsourcing) | Bumping | Oxide Wafer | Cu Wafer |
1. RDL
Specifications:
| Item | Single Side RDL | Double Side RDL |
| Min Si Thickness | 60um | 60um |
Copper Thickness | >1um | >1um |
Copper Line/Space | Min 2um/2um | Min 2um/2um |
| Min Chip Size | 0.6mm×0.3mm | 0.6mm×0.3mm |
| Tape&Reel | Min die thickness 90um | Min die thickness 90um |
Structural representation:
2. TSV
Specifications:
| Item | TSV 10:100 | TSV 20:200 |
Wafer size | 300mm | 300mm |
Si Thickness | 100um±10um | 200um±10um |
Via size | 10um±1.5um | 20um±3um |
Metal layers | Top side: 3 layer Bottom side: 2layer | Top side: 3layer Bottom side: 2layer |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Micro Bump Pitch | Min 40um | Min 40um |
Structural representation:
3. Bumping
Specifications:
| Item | Wafer Bumping |
Wafer Size | 300mm/200mm |
Bump Pitch | Min 40um |
Bump Size | Min10um |
Bump Height | <80um |
| RDL Line/Space | Min |
Structural representation:
4. Oxide Wafer
Specifications:
| Item | Oxide Wafer | Oxide Wafer |
Wafer size | 300mm | 200mm |
SiO2 Thickness | 0.1um~6um | 0.1um~6um |
5. Cu Wafer
Specifications:
| Item | Cu Wafer | Cu Wafer |
Wafer size | 300mm | 200mm |
Cu Thickness | ≥1um | ≥1um |
6. Fan-out Dummy Molding Wafer
| Item | Metal Carrier | Glass or Silicon Wafer |
Molding wafer size | 300mm | 294mm or 297mm |
Molding wafer thickness | 250um~1000um | 100um~1000um |
