WLCSP Structure: 

• 1M，Ball on UBM on Pad 

• 1P1M，Ball on UBM with PI 

• 2P1M，Ball on RDL without UBM 

• 2P2M，Ball on RDL with UBM 

Process Capabilities: 

• Wafer size: 8 & 12 inch

• Die Size: 0.2x0.4 mm - 8x8 mm

• Wafer Thickness: ≥300μm（12 inch）

• Dielectric materials: PI or PBO UBM: Sputtering Ti/Cu

• RDL Line/Space: ≥ 5um/5um

• WLCSP Ball Pitch: 0.40mm or 0.50mm